![]() ![]() ![]() ![]() Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Manufacturer: Datacon Model: 2200 EVO Datacon 2200 Evo Vintage 2011 Tool features: High speed multi chip module assembly SiP stacked die / epoxy, spacer film and WBL (Wafer Backside Lamination) Thin die handling (down to below 30 m) Reticl. Innovative Solution for Innovative Products ![]()
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